pk588 (v1. 0 ) january 25 , 201 3 www.xilinx.com 1 pk 588 ( v 1 . 0 ) january 25 , 201 3 100% material declaration data sheet for 7 series ffg 115 8 average weight: 1 3.6002g component substance description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total silicon die 0.828955 6.095 silicon (si) 7440- 21- 3 100.00 basis 0.828955 solder bump 0.038857 0.286 tin (sn) 7440- 31- 5 63.00 basis 0.024480 lead (pb) 7439- 92- 1 37.00 basis 0.014377 solder paste 0.011300 0.083 tin (sn) 7440- 31- 5 96.50 basis 0.010905 silver (ag) 7440- 22- 4 3.00 basis 0.000339 copper (cu) 7440- 50- 8 0.50 basis 0.000057 capacitor 1 0.041280 0.304 batio3 type 12047- 27- 7 70.60 ceramic 0.029144 nickel (ni) 7440- 02- 0 6.70 inner electrode 0.002766 copper (cu) 7440- 50- 8 20.1 0 outer electrode 0.008297 nickel (ni) 7440- 02- 0 0.80 plating 1 0.000330 tin (sn) 7440- 31- 5 1.80 plating 2 0.000743 capacitor 2 0.015200 0.112 batio3 type 12047- 27- 7 61.70 ceramic 0.009378 nickel (ni) 7440- 02- 0 4.89 inner electrode 0.000743 indium tin oxide 50926- 11- 9 18.30 outer electrode 0.002782 copper (cu) 7440- 50- 8 13.40 outer electrode 0.002037 nickel (ni) 7440- 02- 0 0.49 plating 1 0.000074 tin (sn) 7440- 31- 5 1.22 plating 2 0.000185 capacitor 3 0.003000 0.022 batio3 type 12047- 27- 7 66.00 ceramic 0.001980 nickel (ni) 7440- 02- 0 2.67 inner electrode 0.000080 copper (cu) 7440- 50- 8 23.33 outer electrode 0.000700 nickel (ni) 7440- 02- 0 2.33 plating 1 0.000070 tin (sn) 7440- 31- 5 5.67 plating 2 0.000170 ? copyright 201 3 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designated brands included herein are trademarks of xil inx in the united states and other countries. all other trademarks are the property of their respective owners
100% material declaration data sheet ? 7 series ffg115 8 pk 588 (v1.0) january 25 , 201 3 www.xilinx.com 2 component substan ce description cas number or description percentage of component use in product component weight/ substance weight (grams) component percent of total capacitor 4 0.011160 0.082 batio3 type 12047- 27- 7 51.10 ceramic 0.005703 nickel (ni) 7440- 02- 0 27.00 inner electrode 0.003013 copper (cu) 7440- 50- 8 16.00 outer electrode 0.001786 glass 65997- 17- 3 0.90 0.000100 nickel (ni) 7440- 02- 0 2.00 plating1 0.000223 tin (sn) 7440- 31- 5 3.00 plating2 0.000335 underfill 0.082000 0.603 bisphenol f/ epichlorohydrin copolymer 9003- 36- 5 20.00 basis 0.016400 phenolic resin trade secret 15.00 basis 0.012300 bisphenol a type liquid epoxy resin 25068- 38- 6 5.00 basis 0.004100 amine type accelerator trade secret 5.00 basis 0.004100 silicon dioxide 60676- 86- 0 51.50 basis 0.042230 carbon black 1333- 86- 4 1.00 basis 0.000820 additives trade secret 2.50 additive 0.002050 lid 7.290000 53.602 copper (cu) 7440- 50- 8 99.15 main material 7.228035 nickel (ni) 7440- 02- 0 0.85 main material 0.061965 lid adhesive 0.215000 1.581 aluminium oxide al2o3 1344- 28- 1 70.00 main material 0.150500 dimethyl siloxane, dimethylvinyl - terminated 68083- 19- 2 30.00 main material 0.064500 solder ball 0.964719 7.093 tin (sn) 7440- 31- 5 96.50 main material 0.930954 silver (ag) 7440- 22- 4 3.00 main material 0.028942 copper (cu) 7440- 50- 8 0.50 main material 0.004824 substrate 4.098707 30.137 copper (cu) 7440- 50- 8 43.34 1.776380 tin (sn) 7440- 31- 5 1.16 0.047545 lead (pb) 7439- 92- 1 0.33 0.013526 silver (ag) 7440- 22- 4 0.02 0.000820 bt core n/a 38.40 1.573903 abf n/a 14.90 0.610707 solder mask n/a 1.85 0.075826
100% material declaration data sheet ? 7 series ffg115 8 pk 588 (v1.0) january 25 , 201 3 www.xilinx.com 3 revision history the following table shows the revision history for this document. notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test and assembly of hardware devices to independent third - party vendors and materials suppliers (?contractors?). all data pr ovided hereunder is based on information received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products . date version description of revisions 0 1 /2 5 /201 3 1.0 initial xilinx release.
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